【公开课】微纳加工 - 瑞士联邦理工学院(洛桑联邦理工学院/EPFLx)-(Micro and Nanofabrication(MEMS),英文授课,英文字幕)

2.2万
27
2020-03-01 09:41:08
273
83
1556
175
https://www.edx.org/course/micro-and-nanofabrication-mems 微纳加工(Micro and Nanofabrication-MEMS,英文授课及字幕)- 瑞士联邦理工学院/EPFLx Learn the fundamentals of microfabrication and nanofabrication by using the most effective techniques in a cleanroom environment.
www.bilibili.com/read/cv9038294 关于“微电子与纳电子学”的使用说明及版权声明
视频选集
(41/64)
1.0 Teaser
03:20
1.1.1 Successful MEMS products:accelerometer
08:57
1.1.2 Successful MEMS products:microphone
04:43
1.1.3 Successful MEMS products:BAW
09:50
1.2 Case study:thermo-mechanical micro-actuator
14:53
1.3.1 Cleanroom basics:introducing the issue of contamination
13:11
1.3.2 Cleanroom basics:cleanroom strategy
05:57
2.1.1 Basic principles of CVD and CVD reactors
14:16
2.1.2 CVD techniques at different operating pressure, plasma-enhanced CVD and me
12:10
2.1.3 Atomic layer CVD (ALD) and thermal oxidation of silicon
08:40
2.2.1 Theoretical concepts of gas flow in CVD reactors
09:30
2.2.2 CVD thin film growth model
12:43
2.3.1 Specific CVD processes for silicon-based materials and diamond
15:28
2.3.2 Thermal oxidation processes of silicon and ALD deposition of specific oxid
12:13
3.1.1 Thermal evaporation:introduction and vapor creation
12:34
3.1.2 Thermal evaporation:film formation and examples
10:33
3.1.3 Thermal evaporation in CMi
03:28
3.2.1 Sputtering:introduction and plasma formation
08:23
3.2.2 Sputtering:spatial zones and Paschen law
06:23
3.2.3 Sputtering:DC, RF, magnetron
09:58
3.2.4 Sputtering:ion target interactions
06:27
3.2.5 Sputtering:film growth and control parameters
08:19
3.2.6 Sputtering:examples
11:41
3.2.7 Sputtering in CMi
02:43
3.3 SUPPLEMENTARY Other PVD methods
19:42
3.4.1 Film growth:atoms arrival and adhesion
06:49
3.4.2 Film growth:stress in thin films
09:16
3.4.3 SUPPLEMENTARY Film growth:growth modes and crystal structure
10:45
4.1.1 Introduction to lithography
06:41
4.1.2 Resist properties and exposure methods
12:23
4.1.3 SUPPLEMENTARY Photoresist sensitivity and modulation transfer function
04:07
4.2.1 UV lithography:direct writing and mask writing
11:22
4.2.2 UV lithography in CMi:mask fabrication
03:50
4.2.3 UV lithography:mask based lithography
09:34
4.2.4 UV lithography in CMi:mask based lithography
03:03
4.3.1 Electron beam lithography:tool overview
10:20
4.3.2 Electron beam lithography:electron optics and beam deflection
05:08
4.3.3 SUPPLEMENTARY Electron beam lithography:tool overview II
05:28
4.3.4 SUPPLEMENTARY Electron beam lithography:design preparation and fracture
13:26
4.3.5 Electron beam lithography:electron-sample interactions
10:01
4.3.6 Electron beam lithography:resists
05:54
4.3.7 SUPPLEMENTARY Electron beam lithography:proximity effect
09:07
4.4.1 Alternative patterning methods:scanning probe lithography
07:51
4.4.2 SUPPLEMENTARY Alternative patterning methods:replication methods
16:18
5.1.1 Dry etching in a gas plasma:etching anisotropy
16:15
5.1.2 Deep dry etching of silicon; dry etching without a plasma
15:42
5.2 Theoretical concepts of plasma generation
13:13
5.3.1 Types of dry etching equipment and plasma sources
16:52
5.3.2 Ion beam etching
07:26
5.4.1 Examples of etching processes for Si-based materials
22:19
5.4.2 Examples of etching processes for organic films and metals
12:34
6.0 Anisotropic and isotropic wet etching of Si and applications
14:46
6.1 HF bath for SiO2 and glass wet etching
12:28
6.2.1 Isotropic wet etching of silicon in the HNA bath
19:21
6.2.2 Anisotropic wet etching of silicon in alkaline baths
18:04
6.3.1 Etch stop techniques for thin membrane microfabrication and bulk micromach
13:49
6.3.2 Supercritical drying for realization of suspended structures; test microst
12:33
7.1.1 Optical microscopy:inspection and dimension measurement
09:49
7.1.2 Optical thin film thickness measurement
07:07
7.1.3 Optical surface profile measurement
09:28
7.2 Mechanical surface profile measurement
09:06
7.3.1 Scanning electron microscopy
10:46
7.3.2 Focused ion beam:local cross sectional inspection and measurement
06:46
7.4 Electrical characterization
07:34
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