AI时代最肥的一块肉，被韩国叼在嘴里。47天后，120万个账户收到强平短信。从1986年的东京，到2026年的首尔，同一本剧本翻了两遍。
部分信源：
[01] KODEX 삼성전자단일종목레버리지 투자설명서 / 삼성증권
[02] KODEX SK하이닉스단일종목레버리지 투자설명서 / 삼성증권
[03] Addition of Entities to the Entity List / Bureau of Industry and Security, Commerce.
[04] Department of Commerce Announces the Addition of Huawei Technologies Co. Ltd. to the Entity List / U.S. Department of Commerce
[05] CONSUMER PRICE INDEX – JUNE 2026 / U.S. Bureau of Labor Statistics
[06] Historical and current prices for DRAM, HBM, and NAND flash. / Stanford University
[07] ETF REPORT 2026.5.22 / 삼성증권
[08] 단일종목 레버리지ㆍ인버스 ETF 출시 전후 주식시장 동향 및 시사점 / 자본시장연구원
[09] 개별 주식 레버리지 리밸런싱 효과 / 삼성증권
[10] Trends in the Semiconductor Industry / Semiconductor History Museum of Japan
[11] Japan Report / U.S. DEPARTMENT OF COMMERCE
[12] 64K DYNAMIC RANDOM ACCESS MEMORY COMPONENTS FROM JAPAN / USITC PUBLICATION
[13] Memorandum Semi Conductor 301 / reagan library
[14] Arrangement between the Government of Japan and the Government of the United States of America Concerning Trade in Semiconductor Products / WTO
[15] Memorandum on Tariff Increases on Japanese Semiconductor Products / reagan library
[16] 半導体の100年史と近未来 / NOMURA
[17] The U.S.-Japan Agreement of 1986 on Semiconductor Products, Side Letter / The University of Tokyo
[18] 国政府とアメリカ合衆国政府との間の半導体の貿易に関する交換公 / 外務省
[19] Certain NAND and DRAM Memory Chips; Institution of Investigation / U.S. International Trade Commission.
[20] Case 5:26-cv-06345-NW / UNITED STATES DISTRICT COURT NORTHERN DISTRICT OF CALIFORNIA
[21] SK hynix Inc. / SEC
[22] HBM Pricing & Market Share (2026) / Silicon Analysts
[23] Memory's Margins: Separating Structural Improvement From Cyclical Peak / Pzena Investment Management
[24] The AI Memory Supercycle: How HBM Became AI's Most Critical Bottleneck / introl
[25] Global DRAM and HBM Market Share: Quarterly / Counterpoint
[26] DDR5 Now More Profitable Than HBM for All Major Memory Makers / abit.ee
